编辑“︁IPhone 4”︁（章节）

=== 晶片與記憶體 ===
iPhone 4是由[[Apple A4]]晶片驅動，該晶片由[[Intrinsity]]設計<ref name="anandtech intrinsity 1">{{cite web|last=Garnesh|first=T S|title=Apple's Intrinsity Acquisition: Winners and Losers|url=http://www.anandtech.com/show/3665/apples-intrinsity-acquisition-winners-and-losers|publisher=AnandTech|accessdate=2012-07-17|archive-date=2019-08-31|archive-url=https://web.archive.org/web/20190831052917/https://www.anandtech.com/show/3665/apples-intrinsity-acquisition-winners-and-losers|dead-url=no}}</ref>，與之前的所有iPhone型號一樣由[[三星集團|三星]]生產<ref name="PCW iP4 display explained 1">{{cite web|url=http://www.pcworld.com/article/198201/iphone_4s_retina_display_explained.html|title=Apple's new iPhone 4|date=2010-06-15|publisher=TechAutos|accessdate=2010-06-18|archive-url=https://web.archive.org/web/20120828060038/http://www.pcworld.com/article/198201/iphone_4s_retina_display_explained.html|archive-date=2012-08-28|dead-url=yes}}</ref>。這[[系統單晶片]]上系統由[[ARM架構|ARM Cortex-A8]][[中央處理器|CPU]]組成，與[[PowerVR|PowerVR SGX535]][[圖形處理器|GPU]]整合<ref name="NYT CPU battle 1">{{cite news|url=https://www.nytimes.com/2010/02/22/technology/22chip.html|title=For Chip Makers, the Next Battle Is in Smartphones with better technology|first=Ashlee|last=Vance|date=2010-02-21|work=The New York Times|accessdate=2010-06-19|archive-date=2010-02-25|archive-url=https://web.archive.org/web/20100225065617/http://www.nytimes.com/2010/02/22/technology/22chip.html|dead-url=no}}</ref>。Apple A4晶片也適用於[[iPad]]，其額定速度為1GHz。iPhone 4的轉速尚未公佈。所有iPhone的先前型號都已經對CPU進行了[[降頻]]處理，這通常可以延長電池壽命並降低其散熱效能。

iPhone 4擁有512 MB的[[動態隨機存取記憶體|DRAM]]。額外的DRAM支援更高性能和多任務處理<ref name="ifixit iP4 RAM 1">{{cite web|url=http://www.ifixit.com/Teardown/iPhone-4-Teardown/3130/1|title=iPhone 4 Confirmed to Have 512MB of RAM (Twice the iPad and 3GS)|first=Arnold|last=Kim|date=2010-06-17|publisher=[[MacRumors]]|accessdate=2010-06-19|archive-date=2010-06-28|archive-url=https://web.archive.org/web/20100628052241/http://www.ifixit.com/Teardown/iPhone-4-Teardown/3130/1|dead-url=no}}</ref>。